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新產(chǎn)品簡(jiǎn)介-加強(qiáng)型焊柱Cu-CCGA

 

    加強(qiáng)型錫柱是在普通錫柱的基礎(chǔ)上演變而來。通過在普通焊線上繞一定規(guī)格的銅線，然后在進(jìn)行電鍍Sn63/Pb37合金形成良好的外觀。加強(qiáng)型焊柱具有比普通焊錫柱更好的熱循環(huán)性能，同時(shí)在CCGA封裝時(shí)，Sn20/Pb80（固相點(diǎn)183℃，液相點(diǎn)280℃）合金具有更好的回流焊窗口。

      Copper wrap solder columns based on the plain solder columns are an advnced development.we will wind a certain size copper wires or copper foils around the core solder wire, then The hot solder coating(Sn63/Pb37 eutectic alloy) is appendedCompared with traditional plain solder columns,copper wrap solder columns have better thermal cycling ability, and Sn20/Pb80 alloy (The solidus temperature, 183℃, the liquidus temperature, 280℃) makes it more suitable for reflow soldering window.